Introduction
Bimonthly, started in 1957
Administrator
Shanxi Provincial Education Department
Sponsor
Taiyuan University of Technology
Publisher
Ed. Office of Journal of TYUT
Editor-in-Chief
SUN Hongbin
ISSN: 1007-9432
CN: 14-1220/N
Administrator
Shanxi Provincial Education Department
Sponsor
Taiyuan University of Technology
Publisher
Ed. Office of Journal of TYUT
Editor-in-Chief
SUN Hongbin
ISSN: 1007-9432
CN: 14-1220/N
location: home > paper >
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Effect of Sn on Microstructure and Properties of Cu-Ni-Ti Alloys
DOI:
10.16355/j.cnki.issn1007-9432tyut.2018.04.001
Received:
Accepted:
| Corresponding author | Institute | |
| CHEN Jin | College of Materials Science and Engineering, Taiyuan University of Technology |
abstract:
With the very large scale integration lead frame material as object of study and on the basis of preliminary tests, Sn was added to Cu-Ni-Ti alloy by using ordinary metal casting forming method for smelting.The effects on alloy microstructure, phase change, conductivity and hardness properties were studied by adding different contents (0.757%, 0.865% and1.187%) of Sn to the C3 N1 Talloy.Results show that Sn can refine the alloy organized system, improve the alloy hardness and electrical conductivity significantly.The excellent comprehensive hardness and conductivity, make the alloy be of promising application prospect.
Keywords:
Cu-Ni-Ti-Sn alloy; Sn; microstructure; vickers hardness; conductivity;